Cooling system and cooling method for electronic component in electronic device

The invention provides a cooling method for cooling an electronic component in an electronic device. The cooling method comprises that a heat absorption component is provided, the heat absorption component is movably arranged in the electronic device, and the electronic component is at a first temperature T1, and the heat absorption component is at a second temperature T2; when the first temperature T1 of the electronic component is higher than the second temperature T2 of the heat absorption component, and the temperature difference between the first temperature T1 and the second temperature T2 is higher than a preset temperature difference [delta]T (T1-T2>[delta]T), the heat absorption component is arranged on the first position of the electronic device, and the heat absorption component is contacted with the electronic component; when the first temperature T1 is higher than the second temperature T2, and the temperature difference between the first temperature T1 and the second temperature T2 is lower than the preset temperature difference [delta]T (0