Method for fabricating a semiconductor package and semiconductor package
The invention relates to a method for fabricating a semiconductor package and a semiductor package. The method includes providing a first substrate having an aperture, providing a first semiconductor chip, connecting the first semiconductor chip to the first substrate, filling the aperture with a fi...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention relates to a method for fabricating a semiconductor package and a semiductor package. The method includes providing a first substrate having an aperture, providing a first semiconductor chip, connecting the first semiconductor chip to the first substrate, filling the aperture with a first insulating material and encapsulating the semiconductor chip with a second insulating material to create a first encapsulation body. |
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