Quick grinding technology for die positioning plate

The invention relates to a quick grinding technology for a die positioning plate. The technology comprises the steps of blank sizing, blank heat treatment and grinding. The method is characterized in that grinding is achieved through excircle rough grinding, excircle accurate grinding, plane rough grinding, plane accurate grinding, hole and arc surface grinding and the like. By the adoption of the technology, quick grinding of the die positioning plate can be achieved, and it is guaranteed that the holes, arc surface, hole diameter, hole distance and roughness of a die part completely comply with the drawing under the high-hardness material condition; furthermore, the machining time is short, machining cost is low, and the production efficiency is low.