SILVER ALLOY SPUTTERING TARGET FOR FORMING ELECTROCONDUCTIVE FILM, AND METHOD FOR MANUFACTURING SAME

A silver alloy sputtering target having a component composition containing a total of 0.1 to 1.5% by mass of In and/or Sn, which are elements that form a solid solution in Ag, with the remainder being made up by Ag and unavoidable impurities, the average grain diameter of the crystal grains being 1...

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Bibliographische Detailangaben
Hauptverfasser:	KOMIYAMA SHOZO, KOIKE SHINYA, FUNAKI SHINICHI, OKUDA SEI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	A silver alloy sputtering target having a component composition containing a total of 0.1 to 1.5% by mass of In and/or Sn, which are elements that form a solid solution in Ag, with the remainder being made up by Ag and unavoidable impurities, the average grain diameter of the crystal grains being 1 [mu]m to less than 30 [mu]m, and fluctuations in the grain diameter of the crystal grains being no greater than 30% of the average grain diameter. The silver alloy sputtering target is manufactured by subjecting a melt-cast ingot to a hot rolling step, a cooling step, cold rolling, heat processing, and a machining processing step, in the stated order.