Diode lead sizing sealing device capable of achieving uniform sizing

The invention discloses a diode lead sizing sealing device capable of achieving uniform sizing. The device comprises a supporting platform. A transmission chain and a sizing sealing rack are arranged on the supporting platform. The sizing sealing rack comprises a plurality of sizing sealing teeth. Gluing ports are formed above the sizing sealing rack and communicated into a sizing groove. Lead placement end blocks are arranged in the diode lead sizing sealing device capable of achieving uniform sizing and fixedly arranged on the transmission chain. A plurality of lead placement holes are formed in each lead placement end block. In the sizing sealing rack, one gluing port is formed between every two adjacent sizing sealing teeth, and each gluing port is internally provided with at least two gluing port holes. By the adoption of the technical scheme, according to the diode lead sizing sealing device capable of achieving uniform sizing, the uniformity of sizing fluid at the diode lead sizing sealing position is effectively ensured by optimizing the contact time and area between the lead and the sizing fluid.