Signal transmission line structure and electronic apparatus using signal transmission line structure

The invention relates to a signal transmission line structure and an electronic apparatus using the signal transmission line structure. The signal transmission line structure comprises a substrate, a plurality of TSV (Through Silicon Via) type grooves, conductive substances, at least one conductive circuit and a dielectric layer. The substrate has a first surface and a second surface which are opposite to each other. The TSV type grooves are formed in the first surface of the substrate and extend along the first surface. Bottoms of the TSV type grooves are positioned between the first surface and the second surface. The conductive substances fill the TSV type grooves to form transmission lines. The at least one conductive circuit is positioned above the transmission lines. The dielectric layer is positioned on the first surface of the substrate and isolates the at least one conductive circuit from the transmission line.