Semiconductor device
In order to prevent a crack from occurring from an impact in an interlayer insulation film below a bonding pad, provided is a bonding pad wherein small-diameter metal plugs (14a) and large-diameter metal plugs (14b) are positioned between a first metal film (12) and a second metal film (15) which is...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | In order to prevent a crack from occurring from an impact in an interlayer insulation film below a bonding pad, provided is a bonding pad wherein small-diameter metal plugs (14a) and large-diameter metal plugs (14b) are positioned between a first metal film (12) and a second metal film (15) which is a topmost layer, and depression parts (17) are disposed in the surface of the second metal film (15) above the large-diameter metal plugs (14b). |
|---|