Semiconductor package

Semiconductor package

A stacked semiconductor package in an embodiment includes a first circuit board; a first semiconductor package formed through mounting the first semiconductor element on the first circuit board; a second circuit board; a second semiconductor package formed through mounting a second semiconductor ele...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MIYAKOSHI, TAKESHI, HOSOYAMADA, SUMIKAZU, KUMAGAYA, YOSHIKAZU, CHIKAI, TOMOSHIGE, SAKUMOTO, SHOTARO, NAKAMURA, SHINGO, MATSUBARA, HIROAKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A stacked semiconductor package in an embodiment includes a first circuit board; a first semiconductor package formed through mounting the first semiconductor element on the first circuit board; a second circuit board; a second semiconductor package formed through mounting a second semiconductor element on the second circuit board, the second semiconductor package being stacked on the first semiconductor package; a sealing resin sealing the first semiconductor element; a conductive layer located in contact with the sealing resin; and a thermal via connected to the conductive layer and located on the first circuit board.