Method for manufacturing single-surface thin type metal substrate

The invention provides a method for manufacturing a single-surface thin type metal substrate, and the method comprises the following steps: butting two polyimide films, in order to form a first coating surface and a second coating surface; carrying out chemical nickel plating work on the first coating surface and the second coating surface, in order to form a nickel layer respectively; then carrying out electro-coppering work, in order to form a copper layer on each nickel layer; separating the two polyimide films from the joint position, in order to form two single-surface thin type metal substrates. After the two polyimide films are butted, one nickel layer and one copper layer are then formed simultaneously in one metallization technology, that is two single-surface thin type metal substrates are manufactured at the same time, so that production cost is reduced, and the metallization technology can meet the thin type demand including fine wire, micropore and high density.