Thermosetting chip bonding film, cutting/chip bonding film and semiconductor making method

A thermosetting chip bonding film, a cutting/chip bonding film and a semiconductor making method are provided; the thermosetting chip bonding film can properly be broken under stretch stress under low temperature, and an energy storage modulus A under 0DEG C before thermosetting is above 1GPa, and l...

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Bibliographische Detailangaben
Hauptverfasser:	SADAHITO MISUMI, YUICHIRO SHISHIDO, KENJI ONISHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A thermosetting chip bonding film, a cutting/chip bonding film and a semiconductor making method are provided; the thermosetting chip bonding film can properly be broken under stretch stress under low temperature, and an energy storage modulus A under 0DEG C before thermosetting is above 1GPa, and loss modulus B under 0DEG C is below 500MPa; loss tangent C under 0 DEG C is under 0.1, glass conversion temperature D is above 0 DEG C, wherein the D absolute value and the loss tangent C absolute value follow the ratio E above 600.