Three dimensional integrated circuit and method for controlling the same

A three dimensional integrated circuit includes a master circuit, a slave circuit, and a through-silicon via (TSV). The master circuit is configured to receive and process an input data, a data strobe signal (DQS) and an input command to output a writing data signal to a master die. The through-silicon via (TSV) is electrically coupled between the master circuit and the slave circuit. The master circuit is configured to transfer the writing data signal to a slave die through the TSV. Furthermore, a method for controlling a three dimensional integrated circuit is disclosed herein. The three dimensional integrated circuit and the control method thereof can improve the problem of the TSVs size in the die cannot be decreased.