Semiconductor device and method of fabricating the same

The invention provides a semiconductor device and a method of fabricating the same. According to one embodiment, a first semiconductor element has a first electrode connected to the first conductor, a second electrode connected to the second conductor, and a control electrode connected to a first si...

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Bibliographische Detailangaben
Hauptverfasser: HIDEO NISHIUCHI, TAKASHI TOGASAKI, TAKAYUKI TAJIMA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention provides a semiconductor device and a method of fabricating the same. According to one embodiment, a first semiconductor element has a first electrode connected to the first conductor, a second electrode connected to the second conductor, and a control electrode connected to a first signal terminal. A second semiconductor element has a first electrode connected to the first conductor, and a second electrode connected to the second conductor. A third semiconductor element has a first electrode connected to the third conductor, a second electrode connected to the fourth conductor, and a control electrode connected to a second signal terminal. A fourth semiconductor element has a first electrode connected to the third conductor, and a second electrode connected to the fourth conductor.