Semiconductor device and semiconductor technology

The invention relates to a semiconductor device and a semiconductor technology. The semiconductor device comprises a substrate, a circuit layer, a plurality of under bump metallurgy layers UBM, a redistribution layer and a plurality of pieces of interconnected metal. The substrate is provided with a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OU, YING-TE, HUANG, CHE-HAU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention relates to a semiconductor device and a semiconductor technology. The semiconductor device comprises a substrate, a circuit layer, a plurality of under bump metallurgy layers UBM, a redistribution layer and a plurality of pieces of interconnected metal. The substrate is provided with an active surface and a passive surface. The circuit layer and the under bump metallurgy layers UBM are arranged on the active surface in an adjacent manner. The redistribution layer is close to the passive surface. The interconnected metal is electrically connected with the circuit layer and the redistribution layer.