Method for processing abnormal wafer
The invention provides a method for processing an abnormal wafer. The method for processing the abnormal wafer at least includes a step of removing cured polyimide on the surface of the wafer, the step at least includes: providing an abnormal wafer having a protective area on which cured polyimide i...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention provides a method for processing an abnormal wafer. The method for processing the abnormal wafer at least includes a step of removing cured polyimide on the surface of the wafer, the step at least includes: providing an abnormal wafer having a protective area on which cured polyimide is formed; coating positive photoresist on the abnormal wafer and polyimide surface; performing exposure on the positive photoresist through a first masking plate, and exposing polyimide on the protective area after development; adopting an etching process to remove the exposed polyimide by etching; and removing the positive photoresist. The method for processing the abnormal wafer changes the way of removing polyimide from conventional cleaning into etching, can completely clean cured polyimide on the surface of the abnormal wafer; the positive photoresist achieves a blocking function in etching processing, thereby protecting the surface of a chip from being damaged, realizing reworking processing of the abnormal wafer with cured polyimide, and preventing the wafer from being scrapped; and the method provided by the invention does not need to modify a technological manufacture process and a machine structure, and is low in industrial cost. |
---|