TIN OR TIN ALLOY ELECTROPLATING BATH AND PROCESS FOR PRODUCING BUMPS USING SAME

The present invention provides a novel tin or tin alloy electroplating bath, which can preferably be used for the production of bumps, and which has excellent recess filling property and can suppress the generation of voids.The electroplating bath includes an inorganic acid and an organic acid, as w...

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Bibliographische Detailangaben
Hauptverfasser:	TSUJIMOTO,MASANOBU, KANO,TOSHIKAZU, IKUMOTO,RAIHEI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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