TIN OR TIN ALLOY ELECTROPLATING BATH AND PROCESS FOR PRODUCING BUMPS USING SAME

The present invention provides a novel tin or tin alloy electroplating bath, which can preferably be used for the production of bumps, and which has excellent recess filling property and can suppress the generation of voids.The electroplating bath includes an inorganic acid and an organic acid, as well as a water-soluble salt thereof; a non-ionic surfactant selected from the group consisting of polyoxyalkylene phenyl ethers, polyoxyalkylene polycyclic phenyl ethers, and salts thereof; and leveling agents containing at least one selected from the group consisting of aliphatic aldehydes, aromatic aldehydes, aliphatic ketones, and aromatic ketones; and at least one selected from the group consisting of [alpha],[beta]-unsaturated carboxylic acids, [alpha],[beta]-unsaturated carboxylic acid amides, and salts thereof.