Epoxy resin composition and epoxy resin material obtained by curing

The invention relates to an epoxy resin composition and an epoxy resin material obtained by curing, and is used for mainly solving the problem of low epoxy resin material modulus in the prior art; the technical problem is better solved through adopting the technical scheme that the epoxy resin compo...

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Bibliographische Detailangaben
Hauptverfasser:	YU RONGLU, YAO BIN, FU RONGZHENG, WEN FENG, WANG FANG
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The invention relates to an epoxy resin composition and an epoxy resin material obtained by curing, and is used for mainly solving the problem of low epoxy resin material modulus in the prior art; the technical problem is better solved through adopting the technical scheme that the epoxy resin composition includes the following components: (1) 20-80 parts by mass of bisphenol A epoxy resin; (2) polyfunctional-group glycidyl amine type epoxy resin, wherein the sum of the amount of the polyfunctional-group glycidyl amine type epoxy resin and the amount of the bisphenol A epoxy resin is 100 parts by mass; and (3) an aromatic diamine curing agent accounting for 10-26 wt% of the total mass of the bisphenol A type epoxy resin and the glycidyl diamine type epoxy resin. The epoxy resin composition can be used in industrial production of the epoxy resin material.