Encapsulation structure and encapsulation method of MEMS optical chip based on interlayer bonding

The invention provides an encapsulation structure and encapsulation method of a MEMS optical chip based on interlayer bonding. The encapsulation structure comprises: a first component, a second component and a third component, wherein the first component comprises an optical transparent matrix, an upper optical anti-reflection film and a patterned lower optical anti-reflection film are respectively plated on an upper surface and a lower surface of the optical transparent matrix; the second component comprises an interlayer; and the third component comprises a MEMS optical chip which can operate and control a light beam under the effect of a MEMS driver; the interlayer is used for connecting the optical transparent matrix and the MEMS optical chip so as to realize the wafer-level bonding of the first component and the third component, and an independent sealing cavity is formed for each MEMS optical chip. The encapsulation structure provided by the invention can be independently designed and is compatible with the process requirement of the MEMS optical chip, the lossless encapsulation of the MEMS optical chip can be realized, the smooth finish of the mirror surface is effectively guaranteed, and the airtight performance is promoted. The encapsulation structure disclosed by the invention has the advantages of being simple in process, easy for batch production, easy to integrate and control; and the encapsulation structure has wide application prospects in the encapsulation of the optical chip.