Cleaning equipment and technique for cleaning electronic components

The invention discloses cleaning equipment used for cleaning electronic components (for example, a camera module or an electronic substrate). The cleaning equipment is provided with a plurality of treatment areas, and one or more conveyers, wherein the conveyers are used for conveying the electronic components to each treatment area successively to allow the electronic components to be treated in the tandem treatment areas sequentially. In one aspect, the electronic components are subjected to plasma treatment at atmospheric pressure in one treatment area. In the other aspect, the cleaning equipment further comprises the multiple separately controlled conveyers, wherein the electronic components are treated during respective processing time in each treatment area; and at least one processing time is different from other processing time.