Liquid cooling medium for electronic device cooling

Liquid cooling medium for electronic device cooling

Liquid cooling mediums employed to immersion-cool electronic hardware devices are disclosed herein. Such liquid cooling mediums have a flash point of at least 190 DEG C, as determined according to ASTM D92, and a viscosity of 27 centistokes ("cSt") or less at 40 DEG C, as determined accord...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MOHAMED ESSEGHIR, ANNY L. FLORY
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVES
CHEMISTRY
DYES
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
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Beschreibung
Zusammenfassung:Liquid cooling mediums employed to immersion-cool electronic hardware devices are disclosed herein. Such liquid cooling mediums have a flash point of at least 190 DEG C, as determined according to ASTM D92, and a viscosity of 27 centistokes ("cSt") or less at 40 DEG C, as determined according to ASTM D445. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors.