Method for producing a semiconductor component
The invention relates to a method for producing a semiconductor component. The method involves following main steps: developing an arrangement with a semiconductor element and an access unit and a fastener is arranged between them. The arrangement is completely or partially cladded. A firmly bonded...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention relates to a method for producing a semiconductor component. The method involves following main steps: developing an arrangement with a semiconductor element and an access unit and a fastener is arranged between them. The arrangement is completely or partially cladded. A firmly bonded connection of the semiconductor element and the access unit is formed. |
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