Semiconductor package piece and semiconductor structure thereof

The invention provides a semiconductor package piece and a semiconductor structure thereof. The semiconductor structure includes a semiconductor substrate with a plurality of first electrically connected pads and second electrically connected pads on the surface, first conductive elements arranged o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XU HONGYUAN, YANG MINGXIAN, LV CHANGLUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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