Semiconductor package piece and semiconductor structure thereof

The invention provides a semiconductor package piece and a semiconductor structure thereof. The semiconductor structure includes a semiconductor substrate with a plurality of first electrically connected pads and second electrically connected pads on the surface, first conductive elements arranged on the first electrically connected pads, and second conductive elements arranged on the second electrically connected pads. By means of the conductive elements with different heights, semiconductor elements with different sizes are vertically overlapped on the first and second conductive elements, so that the area of the semiconductor substrate is not increased, and the light, thin, short and small demand is satisfied.