Automatic marking device for semiconductor inspection

The invention discloses an automatic marking device for semiconductor inspection. The device comprises a microscope, an inspection platform, a base, a moving plate, a linear motor, a lead screw and a marking component, wherein the linear motor drives the moving plate to linearly move through the lead screw; a rotating angle of the linear motor is set; when a first button or a second button is operated each time, a distance of the moving plate driving the microscope to move is equal to a gap between two wafer bodies; when operators discover the wafer bodies with unqualified welding lines, a third button is pressed down; the linear motor drives the marking component to move rightly above the wafer body with the unqualified welding line; the cylinder drives a marking pen to downwards move to mark the wafer body; after the marking pen triggers a travel switch, a cylinder drives the marking pen to upwards move; and meanwhile, the linear motor drives the moving plate to return to an original position. The device is simple in structure, and automatically marks the wafer bodies with the unqualified welding lines; and the operators generate no marking missing or repeated marking, so that the labor intensity of the operators is greatly reduced.