Current redistribution in a printed circuit board

In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer 100b. The power pl...

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Bibliographische Detailangaben
Hauptverfasser:	MOHAMED JAVID, SABAVAT GOUTHAM, RAMANATHAN SUBRAMANIAN, SCEARCE STEPHEN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer 100b. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern 113, a grid pattern, a directional pattern 101, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area.