BONDED MATERIAL AND METHOD FOR PRODUCING SAME
The main purpose of the present invention is to provide: a bonded material in which the thickness of a metal layer can be increased and the bonding between the metal layer and a carbon material layer can be achieved easily, and which is rarely broken; and a method for producing the bonded material....
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The main purpose of the present invention is to provide: a bonded material in which the thickness of a metal layer can be increased and the bonding between the metal layer and a carbon material layer can be achieved easily, and which is rarely broken; and a method for producing the bonded material. A bonded material having such a structure that a CFC layer (3) is bonded to a tungsten layer (4), said bonded material being characterized in that a sintered tungsten carbide layer (5), a SiC-WC mixed layer (6) and sintered SiC and sintered WC (7) both buried in the CFC layer are formed between the CFC layer (3) and the tungsten layer (4), and the layers (3), (4), (5), (6) and (7) are bonded together by a sintering method. |
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