Terahertz detection array chip-level packaging structure

The invention belongs to the field of room-temperature terahertz detection array imaging technology and provides a terahertz detection array chip-level packaging structure to solve a problem of the low terahertz radiation absorptivity of a detection array and a problem that a detection array package is complex in structure, high in cost, and large in size and cannot satisfy a portable requirement. The packaging structure comprises four parts, from top to bottom, including a packaging window, a terahertz detection array, a signal reading-out circuit, and a silicon substrate. The center of the bottom surface of the packaging window is provided with an inwardly-corroded groove with a depth range from 10 to 500[mu]m. The distance between the top of the terahertz detection array and the bottom of the groove is a half of a terahertz radiation wavelength. By means of the packaging structure, a terahertz wave is reflected multiple times between the terahertz detection array and the bottom of the groove such that the terahertz absorption of the terahertz detection array is promoted, the responsivity of a detecting unit is improved, structure is simplified, packaging size is effectively reduced, and production cost is decreased.