Heat-conducting insulating adhesive and preparation method thereof

The invention discloses a heat-conducting insulating adhesive and a preparation method thereof. The heat-conducting insulating adhesive is composed of a component A and a component B; the component A is prepared from such raw materials in percentage by mass as 5%-20% of amino silicon oil, 2%-8% of s...

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Bibliographische Detailangaben
Hauptverfasser:	WANG HAIBO, ZHUO NINGZE, ZHANG NA, ZHU YUEHUA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention discloses a heat-conducting insulating adhesive and a preparation method thereof. The heat-conducting insulating adhesive is composed of a component A and a component B; the component A is prepared from such raw materials in percentage by mass as 5%-20% of amino silicon oil, 2%-8% of silane coupling agent, 40%-70% of epoxy resin and 20%-40% of heat-conducting filler, and the total percentage of the raw materials is 100%; the component b is a curing agent; the mass ratio of the component A to the component B is (1-4) to 1. The heat-conducting insulating adhesive has relatively long working life and relatively high heat conductivity coefficient and volume resistivity, and is especially suitable for insulating heat-conducting packaging and gluing in the fields of electronics and electrical, and the like.