Polytetrafluoroethylene-base metallic-silicon-powder-doped heat dissipation material for LED (light-emitting diode) light sources and preparation method thereof

The invention relates to an LED (light-emitting diode) heat dissipation material, particularly a polytetrafluoroethylene-base metallic-silicon-powder-doped heat dissipation material for LED light sources and a preparation method thereof. The material is prepared from the following raw materials in p...

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Bibliographische Detailangaben
Hauptverfasser: XIONG WENHUA, LI HUASHENG, MEI WUHUA
Format: Patent
Sprache:eng
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Zusammenfassung:The invention relates to an LED (light-emitting diode) heat dissipation material, particularly a polytetrafluoroethylene-base metallic-silicon-powder-doped heat dissipation material for LED light sources and a preparation method thereof. The material is prepared from the following raw materials in parts by weight: 0.2-0.3 part of zirconium disilicide, 1-2 parts of 200-325-mesh metallic silicon powder, 3-5 parts of nano porous graphite powder, 3-4 parts of nano silica sol with the solid content of 10-15%, 3-5 parts of sodium silicate, 30-40 parts of water, 1-3 parts of boron trioxide, 1-2 parts of polyethyleneglycol, 1-1.5 parts of gamma-aminopropyltriethoxy silane, 20-25 parts of 400-600-mesh aluminum nitride micropowder, 40-50 parts of 200-300-mesh polytetrafluoroethylene micropowder and 2-3 parts of assistant. The heat dissipation material has efficient, uniform and stable thermal conductivity, can resist environmental corrosion, light and thermal aging when in use, has the advantages of clean surface, fouling resistance and high durability, is easy for processing and cutting, and is a novel energy-saving LED (light-emitting diode) lamp heat dissipation material.