Impurity-removed copper electrolyte additive and preparation method thereof

The invention discloses an impurity-removed copper electrolyte additive. The impurity-removed copper electrolyte additive is prepared by the following raw materials in parts by weight: 10-11 parts of gelatin, 0.3-0.4 part of nanometer tea polyphenol, 13-14 parts of thiourea, 0.8-1.1 parts of hydrated manganese dioxide, 0.2-0.3 part of active carbon powder, a proper amount of de-ionized water, and 3-4 parts of sulfuric acid of 75 wt%. The copper electrolyte additive uses the hydrated manganese dioxide and the active carbon powder to remove impurity elements harmful to electro-deposited copper; the arsenic removal rate reaches 85%; high-quality cathode copper with low content of such impurities as arsenic, antimony and bismuth can be obtained; the national standard is accorded with; and the resource utilization rate is improved; the nanometer tea polyphenol is added to improve the oxidation resistance and the bacteria resistance of the gelatin and to prolong the service life; and a production process can keep the viscosity of the gelatin stable, and generates no roughening phenomenon of mixing copper foils in the gelatin due to excessive viscosity.