Semiconductor packaging structure with antenna, and manufacturing method thereof
The invention relates to a semiconductor packaging structure with an antenna, and a manufacturing method thereof. The semiconductor packaging structure comprises a substrate, at least one electric component, a chip, the antenna and a molded compound. The electric component and the chip are electrica...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention relates to a semiconductor packaging structure with an antenna, and a manufacturing method thereof. The semiconductor packaging structure comprises a substrate, at least one electric component, a chip, the antenna and a molded compound. The electric component and the chip are electrically connected with the substrate. The antenna is provided with an antenna body and a feed-in part. The antenna body is arranged above the electric component and the chip. Furthermore the feed-in part is electrically connected with the substrate. The molded compound covers the electric component and the chip. The antenna is embedded in the molded compound and is exposed from the upper surface of the molded compound. |
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