Stacked electronic packages

Stacked electronic packages

A stacked electronic package includes a substrate and conductive straps each having sides, a top, and a bottom opposite the top. Each conductive strap is coupled along the bottom to an upper surface of the substrate and is separate from others of the conductive straps. A length of at least one of th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LILY KHOR, CHOO YEE OO, KAI CHOH THONG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A stacked electronic package includes a substrate and conductive straps each having sides, a top, and a bottom opposite the top. Each conductive strap is coupled along the bottom to an upper surface of the substrate and is separate from others of the conductive straps. A length of at least one of the sides is greater than a width of at least another one of the sides. An encapsulant extends over the upper surface and side surfaces of the substrate and the sides of the conductive straps. A passive electronic component is disposed over the conductive straps, and each conductive strap is coupled along the top to a terminal of the passive electronic component.