Bond standoffs for sliding positioning of components in assembly

The invention provides bond standoffs for sliding positioning of components in an assembly. Adhesive bonds may be formed between components (e.g., automotive) by sliding components into position without wiping or removing the uncured adhesive. Here, a first bonding region has an uncured adhesive and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HAMID G. KIA, ELISABETH J. BERGER
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BLASTING CHEMISTRY DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING DYES ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES LIGHTING MECHANICAL ENGINEERING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THERMAL INSULATION IN GENERAL TRANSPORTING USE OF MATERIALS AS ADHESIVES WEAPONS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The invention provides bond standoffs for sliding positioning of components in an assembly. Adhesive bonds may be formed between components (e.g., automotive) by sliding components into position without wiping or removing the uncured adhesive. Here, a first bonding region has an uncured adhesive and a plurality of bond standoffs that is positioned adjacent to a second bonding region. Bond standoffs promote sliding between the first and second components, while substantially retaining the uncured adhesive during the sliding. Bond standoffs can be formed on the surface, for example, by molding or stamping. The first and second bonding regions slide into engagement, followed by applying pressure, heat, and/or energy as needed, to form a solid adhesive bond. Methods of repairing manufactured components (e.g., automotive) are also provided with such techniques, including the ability to slide parts into place without removing the uncured adhesive, using bond standoffs formed as strips of adhesive cured on the substrate component or tacks pinned into a composite substrate component.