Teflon-based iron copper powder doped heat dissipation material for LED light source and preparation method thereof

The invention relates to a teflon-based iron copper powder doped heat dissipation material for an LED light source and a preparation method thereof. The material consists of the following raw materials by weight: 2-3 parts of iron phosphate powder of 200-300 mesh, 0.4-0.6 part of zirconium diboride, 2-4 parts of nanometer silicon nitride, 3-5 parts of sodium silicate, 30-40 parts of water, 1-3 parts of ethyl cellulose, 3-5 parts of graphene oxide, 5-8 parts of silica sol with solid content of 10-15%, 1-2 parts of polyethylene glycol, 1-3 parts of gamma-aminopropyl triethoxysilane, 20-25 parts of nitride aluminum powder of 400-600 mesh, 40-50 parts of teflon powder of 200-300 mesh. The heat dissipation material provided by the invention has the advantages of efficient, uniform, and stable thermal conductivity, resistance to environmental corrosion, light and thermal ageing during usage, clean and dirt-proof surface, safety, environment-friendliness and easiness to processing cutting, and is a novel energy-saving heat dissipation material for LED light fixture.