Chip fuse and manufacturing method therefor
The purpose of the present invention is to provide a chip fuse with improved interruption performance, such as retention of appearance, reduction of sustained arc, and so forth, and a method for manufacturing the same. Provided is a chip fuse (21) wherein a heat-storing layer (23) is formed on an in...
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| creator | YAMAGISHI KATSUYA SEINO HIDEKI |
| description | The purpose of the present invention is to provide a chip fuse with improved interruption performance, such as retention of appearance, reduction of sustained arc, and so forth, and a method for manufacturing the same. Provided is a chip fuse (21) wherein a heat-storing layer (23) is formed on an insulated substrate (22), a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section, said chip fuse (21) comprising surface electrode sections (24a) on both ends in the length direction of the chip fuse and a fuse element section (24b) between the surface electrode sections. In this chip fuse (21), a rectangular bank section (27) is formed over the heat-storing layer and the surface electrode sections so as to surround the fuse element section, and a first protective layer (28) is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed (photo-etched) to form the rectangular bank section. |
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Provided is a chip fuse (21) wherein a heat-storing layer (23) is formed on an insulated substrate (22), a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section, said chip fuse (21) comprising surface electrode sections (24a) on both ends in the length direction of the chip fuse and a fuse element section (24b) between the surface electrode sections. In this chip fuse (21), a rectangular bank section (27) is formed over the heat-storing layer and the surface electrode sections so as to surround the fuse element section, and a first protective layer (28) is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed (photo-etched) to form the rectangular bank section.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SWITCHES ; ELECTRICITY ; EMERGENCY PROTECTIVE DEVICES ; RELAYS ; SELECTORS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150729&DB=EPODOC&CC=CN&NR=104813433A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150729&DB=EPODOC&CC=CN&NR=104813433A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMAGISHI KATSUYA</creatorcontrib><creatorcontrib>SEINO HIDEKI</creatorcontrib><title>Chip fuse and manufacturing method therefor</title><description>The purpose of the present invention is to provide a chip fuse with improved interruption performance, such as retention of appearance, reduction of sustained arc, and so forth, and a method for manufacturing the same. Provided is a chip fuse (21) wherein a heat-storing layer (23) is formed on an insulated substrate (22), a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section, said chip fuse (21) comprising surface electrode sections (24a) on both ends in the length direction of the chip fuse and a fuse element section (24b) between the surface electrode sections. In this chip fuse (21), a rectangular bank section (27) is formed over the heat-storing layer and the surface electrode sections so as to surround the fuse element section, and a first protective layer (28) is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed (photo-etched) to form the rectangular bank section.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SWITCHES</subject><subject>ELECTRICITY</subject><subject>EMERGENCY PROTECTIVE DEVICES</subject><subject>RELAYS</subject><subject>SELECTORS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB2zsgsUEgrLU5VSMxLUchNzCtNS0wuKS3KzEtXyE0tychPUSjJSC1KTcsv4mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hgYmFobGJsbGjsbEqAEAXQMpZg</recordid><startdate>20150729</startdate><enddate>20150729</enddate><creator>YAMAGISHI KATSUYA</creator><creator>SEINO HIDEKI</creator><scope>EVB</scope></search><sort><creationdate>20150729</creationdate><title>Chip fuse and manufacturing method therefor</title><author>YAMAGISHI KATSUYA ; SEINO HIDEKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN104813433A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SWITCHES</topic><topic>ELECTRICITY</topic><topic>EMERGENCY PROTECTIVE DEVICES</topic><topic>RELAYS</topic><topic>SELECTORS</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMAGISHI KATSUYA</creatorcontrib><creatorcontrib>SEINO HIDEKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMAGISHI KATSUYA</au><au>SEINO HIDEKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chip fuse and manufacturing method therefor</title><date>2015-07-29</date><risdate>2015</risdate><abstract>The purpose of the present invention is to provide a chip fuse with improved interruption performance, such as retention of appearance, reduction of sustained arc, and so forth, and a method for manufacturing the same. Provided is a chip fuse (21) wherein a heat-storing layer (23) is formed on an insulated substrate (22), a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section, said chip fuse (21) comprising surface electrode sections (24a) on both ends in the length direction of the chip fuse and a fuse element section (24b) between the surface electrode sections. In this chip fuse (21), a rectangular bank section (27) is formed over the heat-storing layer and the surface electrode sections so as to surround the fuse element section, and a first protective layer (28) is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed (photo-etched) to form the rectangular bank section.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SWITCHES ELECTRICITY EMERGENCY PROTECTIVE DEVICES RELAYS SELECTORS |
| title | Chip fuse and manufacturing method therefor |
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