Chip fuse and manufacturing method therefor

The purpose of the present invention is to provide a chip fuse with improved interruption performance, such as retention of appearance, reduction of sustained arc, and so forth, and a method for manufacturing the same. Provided is a chip fuse (21) wherein a heat-storing layer (23) is formed on an in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YAMAGISHI KATSUYA, SEINO HIDEKI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The purpose of the present invention is to provide a chip fuse with improved interruption performance, such as retention of appearance, reduction of sustained arc, and so forth, and a method for manufacturing the same. Provided is a chip fuse (21) wherein a heat-storing layer (23) is formed on an insulated substrate (22), a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section, said chip fuse (21) comprising surface electrode sections (24a) on both ends in the length direction of the chip fuse and a fuse element section (24b) between the surface electrode sections. In this chip fuse (21), a rectangular bank section (27) is formed over the heat-storing layer and the surface electrode sections so as to surround the fuse element section, and a first protective layer (28) is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed (photo-etched) to form the rectangular bank section.