Method for manufacturing a flip chip circuit device and the flip chip circuit device

The invention relates to a method for manufacturing a flip chip circuit device, with at least the following steps: producing or providing a circuit carrier with a first surface and and a conductive face applied on the first surface, and a semiconductor component with a second surface and and a contact point applied on the second surface; applying a first contact unit on the conductive face, and applying a second contact unit corresponding to the first contact unit to the contact point, to smooth the first contact unit, and to make a contact surface of the first contact uint limit a common first contact plane within a first tolerance; applying adhesive on the first contact unit and/or second contact unit; and pressing the semiconductor component and the circuit carrier to form electric connection between the first contact unit and the second contact unit, and to hard the adhesive to establish mechanical connection between the semiconductor component and the circuit carrier.