Packaging structure and method of MEMS optical chip based on silicon-glass bonding

The invention provides a packaging structure and method of an MEMS optical chip based on silicon-glass bonding. The packaging structure comprises a first part and a second part, wherein the first part comprises optical glass of which the upper surface is coated with an upper optical antireflection film and while the lower surface is provided with a cavity; the upper surface of the cavity meets the requirement on smoothness of an optical surface, and a lower optical antireflection film is plated; the second part comprises the MEMS optical chips; the first part and the second part are subjected to silicon-glass bonding to achieve chip-stage bonding, and an independent sealing cavity is formed for each MEMS optical chip. With the adoption of the structure and the method, the chip-stage packaging requirement can be achieved; the reliability and stability of the chip can be improved; the electric performance, mechanical performance and optical performance for application of the optical chip can be ensured; in addition, the comprehensive level superior to that of other packaging technologies is brought; the packaging cost can be reduced; the packaging efficiency can be increased; the light loss can be decreased; the structure and the method have a wide application prospect in the packaging of optical communication devices and optical sensors.