Polyimide resin film and electronic-device substrate comprising polyimide resin film

[Problem] To provide a polyimide resin film exhibiting heat resistance, a low coefficient of linear expansion, and high transparency. [Solution] A polyimide resin film containing a polyimide resin containing a structural unit represented by formula (1). (In the formula, A represents one or more type...

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1. Verfasser:	KOIDE YASUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	[Problem] To provide a polyimide resin film exhibiting heat resistance, a low coefficient of linear expansion, and high transparency. [Solution] A polyimide resin film containing a polyimide resin containing a structural unit represented by formula (1). (In the formula, A represents one or more types of group selected from the bivalent organic groups represented by formula (2) or formula (3), R1-R3 each independently represent a hydrogen atom, a C1-10 alkyl group, or a C1-10 haloalkyl group, and m represents a natural number.)