Copper-clad substrate with barrier structure and manufacturing method thereof
A copper-clad substrate with a barrier structure comprises a plurality of bearing regions and a plurality of barrier regions. Each bearing region can be used for electrical connection between chips. Each barrier region is formed around each bearing region. The barrier regions of the invention can av...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A copper-clad substrate with a barrier structure comprises a plurality of bearing regions and a plurality of barrier regions. Each bearing region can be used for electrical connection between chips. Each barrier region is formed around each bearing region. The barrier regions of the invention can avoid the problem that after a tin flake forms liquid tin in a reflow oven, short circuit is caused as other signal lines are contacted. |
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