Dispensing method used for encapsulating stay wires inside grain depot
The invention discloses a dispensing method used for encapsulating stay wires inside a grain depot. The method comprises the steps that holing holes evenly formed in a thin film of the grain depot are encapsulated; the stay wires are arranged in the holing holes; medicine bags are tied on the stay w...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The invention discloses a dispensing method used for encapsulating stay wires inside a grain depot. The method comprises the steps that holing holes evenly formed in a thin film of the grain depot are encapsulated; the stay wires are arranged in the holing holes; medicine bags are tied on the stay wires; the medicine bags are arranged on preset positions through the stay wires; the holes formed in the thin film are encapsulated. The purposes that manpower is saved and medicine residues are convenient to take out are achieved. |
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