Surface-treated copper foil and laminate using same

Provided are a surface-treated copper foil exhibiting excellent resin transparency after removal of the copper foil by etching,and a laminate using the same.A surface-treated copper foil, wherein when adhering the copper foil to both surfaces of a polyimide resin substrate from the treated-surface s...

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Bibliographische Detailangaben
Hauptverfasser: ARAI HIDETA, ARAI KOHSUKE, NAKAMURO KAICHIRO, MIKI ATSUSHI
Format: Patent
Sprache:eng
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Zusammenfassung:Provided are a surface-treated copper foil exhibiting excellent resin transparency after removal of the copper foil by etching,and a laminate using the same.A surface-treated copper foil, wherein when adhering the copper foil to both surfaces of a polyimide resin substrate from the treated-surface side,then removing the same from both surfaces by etching,and capturing an image of printed matter on which a linear mark is printed,given that the difference between the top average value(Bt)and the bottom average value(Bb)of a brightness curve produced from the end of the mark to a section on which the mark is not drawn is DeltaB (DeltaB=Bt-Bb)in the obtained observation point/brightness graph,and when the value expressing the position of the intersection nearest the linear mark among the intersections between the brightness curve and Bt is t1 in the observation point/brightness graph,and the value expressing the position of the intersection nearest the linear mark among the intersections between the brightness curve and 0.1 DeltaB is t2,in a range up to a depth of 0.1 DeltaB with Bt from the intersection between the brightness curve and Bt as a reference,then Sv defined in this formula (1) is 3.5 or higher,Sv=(DeltaBx0.1)/(t1-t2) (1).