Method for manufacturing substrate for package

Embodiments of the invention provide a method for manufacturing a substrate for a package, in which the method includes forming a solder resist layer on an uncoated substrate having electrode pads formed thereon to cover the electrode pads, and exposing some regions by dividing the solder resist lay...

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Bibliographische Detailangaben
Hauptverfasser:	HONG, MYEONG HO, LEE, CHANG BO, HONG, DAE JO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Embodiments of the invention provide a method for manufacturing a substrate for a package, in which the method includes forming a solder resist layer on an uncoated substrate having electrode pads formed thereon to cover the electrode pads, and exposing some regions by dividing the solder resist layer into regions including a first region covering some or all of the electrode pads and a second region formed out of the first region and exposing some of the regions. The method further includes developing the solder resist layer including an exposed region and an unexposed region with high energy light, so that a remaining height of the first region is lower than that of the second region and at least upper surfaces of the electrode pads in the first region are exposed.