Resin composition and molded article

The present invention provides a resin composition containing a resin component (A) that is a copolymer containing a structural unit derived from ethylene and a structural unit derived from unsaturated carboxylic acid and/or an ionomer thereof, an amine compound (B) having a melting point of 30 DEG...

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Bibliographische Detailangaben
Hauptverfasser:	SHINYA YOUICHI, AOYAMA MASATAKA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention provides a resin composition containing a resin component (A) that is a copolymer containing a structural unit derived from ethylene and a structural unit derived from unsaturated carboxylic acid and/or an ionomer thereof, an amine compound (B) having a melting point of 30 DEG C or higher and having two or more amino groups per molecule, and inorganic filler (C).