Thermal interface compositions and methods for making and using same

Thermal interface compositions and methods for making and using same

A thermal interface material includes a conformable component and a thermally conductive filler dispersed in the conformable component. The material is provided in at least two segments laterally spaced from one another to define one or more gaps, each of the segments having a length, a width, and a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SURA RAVI K, OUDERKIRK ANDREW J, JEONG HUN
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Beschreibung
Zusammenfassung:A thermal interface material includes a conformable component and a thermally conductive filler dispersed in the conformable component. The material is provided in at least two segments laterally spaced from one another to define one or more gaps, each of the segments having a length, a width, and a height. The average aspect ratio of length to height and/or width to height of the at least two segments is between 1:10 and 10:1.