Pressure-sensitive adhesive composition, pressure-sensitive adhesive tape, and preparation method, carrier and assembly of pressure-sensitive adhesive tape
The invention provides a pressure-sensitive adhesive composition, a pressure-sensitive adhesive tape, and a preparation method, carrier and assembly of the pressure-sensitive adhesive tape. The composition comprises the following components: a (methyl) acrylate polymer containing epoxy monomer units...
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| creator | ALVIN WU SAMUEL WU WAYNE CUI STERLING DENG |
| description | The invention provides a pressure-sensitive adhesive composition, a pressure-sensitive adhesive tape, and a preparation method, carrier and assembly of the pressure-sensitive adhesive tape. The composition comprises the following components: a (methyl) acrylate polymer containing epoxy monomer units, polyester with weight average molecular weight Mw of 40,000-100,000 and with Tg of -40 DEG C to 30 DEG C, epoxy resin, polyol, and an cationic photoinitiator. The pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer formed by the composition and can be a single-sided tape or a double-sided tape. The pressure-sensitive tape provided by the invention can be used in an application occasion with specific requirement on the drop resistance of a bonded product, and is especially suitable for the adhesion of a narrow frame and glass of a smartphone. |
| format | Patent |
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The composition comprises the following components: a (methyl) acrylate polymer containing epoxy monomer units, polyester with weight average molecular weight Mw of 40,000-100,000 and with Tg of -40 DEG C to 30 DEG C, epoxy resin, polyol, and an cationic photoinitiator. The pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer formed by the composition and can be a single-sided tape or a double-sided tape. The pressure-sensitive tape provided by the invention can be used in an application occasion with specific requirement on the drop resistance of a bonded product, and is especially suitable for the adhesion of a narrow frame and glass of a smartphone.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150708&DB=EPODOC&CC=CN&NR=104762050A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150708&DB=EPODOC&CC=CN&NR=104762050A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ALVIN WU</creatorcontrib><creatorcontrib>SAMUEL WU</creatorcontrib><creatorcontrib>WAYNE CUI</creatorcontrib><creatorcontrib>STERLING DENG</creatorcontrib><title>Pressure-sensitive adhesive composition, pressure-sensitive adhesive tape, and preparation method, carrier and assembly of pressure-sensitive adhesive tape</title><description>The invention provides a pressure-sensitive adhesive composition, a pressure-sensitive adhesive tape, and a preparation method, carrier and assembly of the pressure-sensitive adhesive tape. The composition comprises the following components: a (methyl) acrylate polymer containing epoxy monomer units, polyester with weight average molecular weight Mw of 40,000-100,000 and with Tg of -40 DEG C to 30 DEG C, epoxy resin, polyol, and an cationic photoinitiator. The pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer formed by the composition and can be a single-sided tape or a double-sided tape. 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The composition comprises the following components: a (methyl) acrylate polymer containing epoxy monomer units, polyester with weight average molecular weight Mw of 40,000-100,000 and with Tg of -40 DEG C to 30 DEG C, epoxy resin, polyol, and an cationic photoinitiator. The pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer formed by the composition and can be a single-sided tape or a double-sided tape. The pressure-sensitive tape provided by the invention can be used in an application occasion with specific requirement on the drop resistance of a bonded product, and is especially suitable for the adhesion of a narrow frame and glass of a smartphone.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | Pressure-sensitive adhesive composition, pressure-sensitive adhesive tape, and preparation method, carrier and assembly of pressure-sensitive adhesive tape |
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