Pressure-sensitive adhesive composition, pressure-sensitive adhesive tape, and preparation method, carrier and assembly of pressure-sensitive adhesive tape

The invention provides a pressure-sensitive adhesive composition, a pressure-sensitive adhesive tape, and a preparation method, carrier and assembly of the pressure-sensitive adhesive tape. The composition comprises the following components: a (methyl) acrylate polymer containing epoxy monomer units...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ALVIN WU, SAMUEL WU, WAYNE CUI, STERLING DENG
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention provides a pressure-sensitive adhesive composition, a pressure-sensitive adhesive tape, and a preparation method, carrier and assembly of the pressure-sensitive adhesive tape. The composition comprises the following components: a (methyl) acrylate polymer containing epoxy monomer units, polyester with weight average molecular weight Mw of 40,000-100,000 and with Tg of -40 DEG C to 30 DEG C, epoxy resin, polyol, and an cationic photoinitiator. The pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer formed by the composition and can be a single-sided tape or a double-sided tape. The pressure-sensitive tape provided by the invention can be used in an application occasion with specific requirement on the drop resistance of a bonded product, and is especially suitable for the adhesion of a narrow frame and glass of a smartphone.