Pressure-sensitive adhesive composition, pressure-sensitive adhesive tape, and preparation method, carrier and assembly of pressure-sensitive adhesive tape
The invention provides a pressure-sensitive adhesive composition, a pressure-sensitive adhesive tape, and a preparation method, carrier and assembly of the pressure-sensitive adhesive tape. The composition comprises the following components: a (methyl) acrylate polymer containing epoxy monomer units...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention provides a pressure-sensitive adhesive composition, a pressure-sensitive adhesive tape, and a preparation method, carrier and assembly of the pressure-sensitive adhesive tape. The composition comprises the following components: a (methyl) acrylate polymer containing epoxy monomer units, polyester with weight average molecular weight Mw of 40,000-100,000 and with Tg of -40 DEG C to 30 DEG C, epoxy resin, polyol, and an cationic photoinitiator. The pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer formed by the composition and can be a single-sided tape or a double-sided tape. The pressure-sensitive tape provided by the invention can be used in an application occasion with specific requirement on the drop resistance of a bonded product, and is especially suitable for the adhesion of a narrow frame and glass of a smartphone. |
---|