Production method of damp-proof low-formaldehyde urea-formaldehyde resin adhesive

The invention provides a damp-proof low-formaldehyde urea-formaldehyde resin adhesive which comprises the following raw materials in parts by weight: 60-80 parts of modified urea-formaldehyde resin, 10-14 parts of an OPE damp-proof agent and 15-20 parts of a filling material. A production method of...

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Bibliographische Detailangaben
Hauptverfasser: MA YUN, ZHOU ZIXI, ZHOU FAN, CHEN HONGLING, QIN WENXIONG
Format: Patent
Sprache:eng
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Zusammenfassung:The invention provides a damp-proof low-formaldehyde urea-formaldehyde resin adhesive which comprises the following raw materials in parts by weight: 60-80 parts of modified urea-formaldehyde resin, 10-14 parts of an OPE damp-proof agent and 15-20 parts of a filling material. A production method of the damp-proof low-formaldehyde urea-formaldehyde resin adhesive comprises the steps of preparing urea-formaldehyde resin, wherein the formaldehyde is fed once, and urea is fed three times, production of the urea-formaldehyde resin is carried out in three stages, namely pre-polymerization, polymerization and later polymerization, and a coupling agent can be added into the urea-formaldehyde resin in the later stage of polymerization to increase the degree of crosslinking; and adding the OPE damp-proof agent after later stage of polymerization, adding the filling material after the OPE damp-proof agent and the urea-formaldehyde resin are uniformly mixed and stirred, and grinding for 30min by a three-roll grinder to obtain the damp-proof low-formaldehyde urea-formaldehyde resin adhesive. The damp-proof low-formaldehyde urea-formaldehyde resin adhesive provided by the invention has excellent water resistance, good humidity resistance and a small amount of residual formaldehyde, and solves a problem in the shaving board and density board industry today.