Semiconductor package with single sided substrate design and manufacturing methods thereof

The invention discloses a semiconductor package and a manufacturing methods thereof. The semiconductor package includes a substrate unit, a die electrically connected to first contact pads, and a package body covering a first patterned conductive layer and the die. The substrate unit includes: (1) t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SU YUANANG, CHEN CHIANG, LI MINGJIN, HUANG SHIH-FU, CHEN TZU-HUI, CHEN KUANG-HSIUNG, HSIEH PAO-MING, HSIEH CHIA-HSIUNG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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