Structure and method of manufacturing 3D integration scheme

The disclosure relates to a structure and method of manufacturing a 3D integration scheme. The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating a 3D integration scheme for multiple semicon...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DOUGLAS C. LA TULIPE JR, JOHN W. GOLZ, SPYRIDON SKORDAS, POOJA R. BATRA, SUBRAMANIAN S. IYER, KEVIN R. WINSTEL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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